Multi-function equipment implementing fabrication of high-k dielectric layer

ABSTRACT

A multi-function equipment implements a method of fabricating a thin film. The multi-function equipment according to the invention includes a reaction chamber, a plasma source, a plasma source power generating unit, a bias electrode, an AC (Alternating Current) voltage generating unit, a DC (Direct current) bias generating unit, a metal chuck, a first precursor supply source, a second precursor supply source, a carrier gas supply source, an oxygen supply source, a nitrogen supply source, an inert gas supply source, an automatic pressure controller, and a vacuum pump.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of co-pending application Ser. No.16/131,249, filed on Sep. 14, 2018, for which priority is claimed under35 U.S.C. § 120; and this application claims priority of applicationSer. No. 106131698 filed in Taiwan on Sep. 15, 2017 under 35 U.S.C. §119, the entire contents of all of which are hereby incorporated byreference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The invention relates to a high-k dielectric layer, a fabricating methodthereof and a multi-function equipment implementing such fabricatingmethod. And more particularly, the invention relates to a high-kdielectric layer having low leakage current density, a fabricatingmethod thereof and a multi-function equipment implementing suchfabricating method.

2. Description of the Prior Art

In order to meet the requirements of reducing sizes and gate leakagecurrents of semiconductor devices, many gate dielectric materials havinghigh dielectric constant have been proposed to replace the conventionaldielectric layer. Taking silicon-based semiconductor devices as anexample, Al₂O₃, HfO₂, ZrO₂, TiO₂, Y₂O₃, and La₂O₃ and so on have beenproposed to replace the conventional SiO₂ gate dielectric layer.

However, the film quality and defect density of the dielectric layerhave a great influence on the gate leakage current. At present, there isstill considerable room for the process of manufacturing a dielectriclayer having excellent film quality and low defect density, as well asin-process treatment or post-process treatment.

SUMMARY OF THE INVENTION

Accordingly, one scope of the invention is to provide a high-kdielectric layer which has excellent film quality and low defect densityand thus has low leakage current density, a fabricating method thereof,and a multi-function equipment implementing such method. Moreover, thehigh-k dielectric layer according to the invention has excellentreliability.

A high-k dielectric layer according to a preferred embodiment of theinvention is formed in a semiconductor device. The high-k dielectriclayer according to the invention includes M atomic-layer-deposited filmswhere M is an integer larger than 1. The M atomic-layer-deposited filmsare formed in sequence on a material layer of the semiconductor device.The material layer can be a semiconductor layer, a metal layer oranother dielectric layer. Each atomic-layer-deposited film is formed ofan oxide and formed by an atomic layer deposition (ALD) process. Duringfabrication of the M atomic-layer-deposited films, N assigned filmsamong the M atomic-layer-deposited films are bombarded by a non-reactivegas plasma during or after cycles of the ALD process to result in anannealing effect such that a defect density of the N assigned films isreduced, where N is a natural number and less than or equal to M.

In one embodiment, the high-k dielectric layer according to theinvention has a leakage current density less than 1×10⁻⁴ A/cm² when acapacitance equivalent thickness (CET) of the high-k dielectric layer isless than 2 nm. Moreover, the high-k dielectric layer according to theinvention has a thickness ranging from 1 nm to 50 nm.

A method of fabricating a high-k dielectric layer in a semiconductordevice according to a preferred embodiment of the invention, firstly, isto form M atomic-layer-deposited films of an oxide in sequence on amaterial layer of the semiconductor device by an ALD process, where M isan integer larger than 1. The material layer can be a semiconductorlayer, a metal layer or another dielectric layer. During fabrication ofthe M atomic-layer-deposited films, the method according to inventionis, for N assigned films among the M atomic-layer-deposited films, tobombard the N assigned films by a non-reactive gas plasma during orafter cycles of the ALD process to finish the high-k dielectric layer,and to result in an annealing effect such that a defect density of the Nassigned films is reduced, where N is a natural number and less than orequal to M.

In one embodiment, the oxide can be HfO₂, ZrO₂, Al₂O₃, La₂O₃, SiO₂,TiO₂, Y₂O₃, etc.

In one embodiment, an inert gas used to generate the non-reactive gasplasmas can be Ar, He, Ne, He/Ar, He/N₂, He/Ne, etc.

A multi-function equipment according to a preferred embodiment of theinvention implements the method of fabricating a high-k dielectric layerin a semiconductor device. The multi-function equipment according to theinvention includes a reaction chamber, a plasma source, a plasma sourcepower generating unit, a bias electrode, an AC (Alternating Current)voltage generating unit, a DC (Direct current) bias generating unit, ametal chuck, a first precursor supply source, a second precursor supplysource, a carrier gas supply source, an oxygen supply source, an inertgas supply source, an automatic pressure controller, and an vacuum pump.The plasma source is disposed in the reaction chamber and at a top ofthe reaction chamber. The plasma source power generating unit iselectrically connected to the plasma source, and is controlled to outputan AC power to the plasma source. The bias electrode is disposed in thereaction chamber and at a bottom of the reaction chamber. The AC voltagegenerating unit is electrically connected to the bias electrode, and iscontrolled to selectively output an AC voltage or the AC voltagecombined with a DC bias to the bias electrode to control an energy ofbombardment by a non-reactive gas plasma. The DC bias generating unit iselectrically connected to the bias electrode, and is controlled toselectively output a positive DC bias or a negative DC bias to the biaselectrode to control the energy of bombardment by the non-reactive gasplasma. The metal chuck is disposed on the bias electrode, and holds asemi-product of the semiconductor device. The first precursor supplysource is connected with the reaction chamber via a first control valve,and is controlled to supply a first precursor of an oxide to thereaction chamber. The second precursor supply source is connected withthe reaction chamber via a second control valve, and is controlled tosupply a second precursor of the oxide to the reaction chamber. Thecarrier gas supply source is connected with the reaction chamber via afirst flow controller, and is controlled to supply a carrier gas to thereaction chamber. The oxygen supply source is connected with the top ofthe reaction chamber via a second flow controller, and is controlled tosupply an oxygen gas, the oxygen gas being ionized by the AC power ofthe plasma source into an oxygen plasma. The inert gas supply source isconnected with the top of the reaction chamber via a third flowcontroller, and is controlled to supply an inert gas, the inert gasbeing ionized by the AC power of the plasma source into a non-reactivegas plasma. The vacuum pump is connected with the bottom of the reactionchamber via the automatic pressure controller, and automaticallycontrols a pumping rate via the automatic pressure controller to achievean ideal process pressure.

Distinguishable from the prior art, the high-k dielectric layer of theinvention has excellent film quality and low defect density, and has lowleakage current density.

The advantage and spirit of the invention may be understood by thefollowing recitations together with the appended drawings.

BRIEF DESCRIPTION OF THE APPENDED DRAWINGS

FIG. 1 is a cross-sectional view of a high-k dielectric layer accordingto a preferred embodiment of the invention.

FIG. 2 is a cross-sectional view of a modification of the high-kdielectric layer according to the preferred embodiment of the invention.

FIG. 3 is a cross-sectional view of another modification of the high-kdielectric layer according to the preferred embodiment of the invention.

FIG. 4 is a schematic diagram showing the architecture of amulti-function equipment implementing the method according to theinvention.

FIG. 5 is a schematic diagram of an ALD cycle process for fabricating aspecimen labeled as “DHe”, a specimen labeled as “THe”, and a specimenlabeled as “Hf0” according to the invention.

FIG. 6 shows the X-ray photoelectron spectroscopy (XPS) spectra of aPMA-treated specimen DHe, a PMA-treated specimen and a PMA-treatedspecimen Hf0.

FIG. 7 shows high-resolution transmission electron microscopy (HRTEM)images of the PMA-treated specimen DHe, the PMA-treated specimen and thePMA-treated specimen Hf0.

FIG. 8 shows the results of a constant voltage stress test of thePMA-treated specimen DHe, the PMA-treated specimen and the PMA-treatedspecimen Hf0.

DETAILED DESCRIPTION OF THE INVENTION

Please refer to FIG. 1, FIG. 2 and FIG. 3, these drawings schematicallyillustrate, in cross-sectional views, a high-k dielectric layer 1 inaccordance with a preferred embodiment of the invention.

As shown in FIG. 1, FIG. 2 and FIG. 3, the high-k dielectric layeraccording to the preferred embodiment of the invention is formed in asemiconductor device 2. The high-k dielectric layer 1 according to theinvention is formed on a material layer of the semiconductor device 2.The material layer can be a semiconductor layer, a metal layer oranother dielectric layer.

In one embodiment, the semiconductor layer can be formed of Si, Ge,SiGe, GeSn, silicon on insulator, germanium on insulator, group III-Vcompound, group II-VI compound, and group IV-VI compound. The metallayer can be formed of platinum, rhodium, titanium, tungsten, copper,aluminum, Al—Si—Cu alloy, Al—Cu alloy, titanium nitride, tantalumnitride, heavily doped polysilicon and so on.

Also as shown in FIG. 1, FIG. 2 and FIG. 3, the high-k dielectric layer1 according to the preferred embodiment of the invention includes Matomic-layer-deposited films 10 where M is an integer larger than 1. TheM atomic-layer-deposited films 10 are formed in sequence on the materiallayer of the semiconductor device 2. The material layer can be asemiconductor layer, a metal layer or another dielectric layer. Eachatomic-layer-deposited film 10 is formed of an oxide and formed by anALD process.

The ALD process adopted by the invention has the following advantages:(1) having the capability to control the formation of the material innano-metric scale; (2) having the capability to control the filmthickness more precisely; (3) having the capability of large-areaproduction; (4) having excellent uniformity; (5) having excellentconformality; (6) having pinhole-free structure; (7) having low defectdensity; and (8) low deposition temperature, etc. The ALD processadopted by the invention can form the atomic-layer-deposited films 10.

In one embodiment, the oxide can be HfO₂, ZrO₂, Al₂O₃, La₂O₃, SiO₂,TiO₂, Y₂O₃, etc.

In particular, during fabrication of the M atomic-layer-deposited films10, N assigned films 12 among the M atomic-layer-deposited films 10 arebombarded by a non-reactive gas plasma during or after cycles of the ALDprocess to result in an annealing effect such that a defect density ofthe N assigned films 12 is reduced, where N is a natural number and lessthan or equal to M. In FIG. 1, the symbol “11” represents an oxide filmformed by only an ALD process without the bombardment by a non-reactivegas plasma. The symbol “12” represents an oxide film formed with thebombardment by the non-reactive gas plasma during or after cycles of theALD process.

In the example shown in FIG. 1, the number of layers of the N assignedfilms 12 is half of the number of layers of all the film 10, and the Nassigned films 12 are concentrated in the lower half of the high-kdielectric layer 1 of the invention.

In the example shown in FIG. 2, the number of layers of the N assignedfilms 12 is half of the number of layers of all the film 10, and the Nassigned films 12 are concentrated in the upper half of the high-kdielectric layer 1 of the invention.

In the example shown in FIG. 3, the assigned films 12 is intercalatedwith the atomic-layer-deposited films 11, which has not been bombardedby a non-reactive gas plasma, to form the high-k dielectric layer 1 ofthe invention. However, the high-k dielectric layer 1 of the inventionis not limited to the arrangement relationship between theatomic-layer-deposited films 11 without bombardment by a non-reactivegas plasma and the assigned films 12 with bombardment by thenon-reactive gas plasma as shown in FIGS. 1, 2 and 3. The high-kdielectric layer 1 of the invention can also firstly form a plurality ofatomic-layer-deposited films 11 without bombardment by a non-reactivegas plasma, and then from an assigned film 12 with bombardment by thenon-reactive gas plasma.

In one embodiment, an inert gas used to generate the non-reactive gasplasmas can be Ar, He, Ne, He/Ar, He/N₂, He/Ne, etc.

Generally, in the plasma process, Ar is widely used as a working gas fora plasma source. On the other hand, He is generally used as a buffer gasin a vapor deposition process, which serves as a non-flammable gas tocontrol the working pressure. Compared with the Ar plasma, the He plasmahas a higher energy because He has a smaller radius such that He has ahigher ionization energy. In addition, since the mass of He is small,the damage caused by He plasma is lower than that caused by Ar plasma.Therefore, the assigned film 12 is bombarded with a non-reactive gasplasma such as He plasma, and the energy is transferred to the surfaceof the assigned film 12 by plasma bombardment, thereby the energy causesan annealing effect. The increase in the surface temperature of theassigned film 12 enhances the migration of the adatoms adsorbed to thesurface of the assigned film 12, which facilitates the improvement ofthe film quality of the assigned film 12 and reduces the defect densityof the assigned film 12. Another effect caused by an increase intemperature of the assigned film 12 facilitates the removal of ligandsof precursors adsorbed to the surface of the assigned film 12.

Thereby, the high-k dielectric layer 1 according to the invention has aleakage current density less than 1×10⁴ A/cm² when a capacitanceequivalent thickness (CET) of the high-k dielectric layer 1 according tothe invention is less than 2 nm. Moreover, the high-k dielectric layer 1of the invention is applied to a semiconductor device and has athickness ranging from 1 nm to 50 nm, and therefore, the high-kdielectric layer 1 of the invention can replace the conventionalultra-thin SiO₂ film.

A method of fabricating a high-k dielectric layer 1, as shown in FIGS.1, 2 and 3, in a semiconductor device 2 according to a preferredembodiment of the invention, firstly, is to form Matomic-layer-deposited films 10 of an oxide in sequence on a materiallayer of the semiconductor device 2 by an ALD process, where M is aninteger larger than 1. The material layer can be a semiconductor layer,a metal layer or another dielectric layer.

During fabrication of the M atomic-layer-deposited films 10, the methodaccording to invention is, for N assigned films 12 among the Matomic-layer-deposited films 10, to bombard the N assigned films 12 by anon-reactive gas plasma during or after cycles of the ALD process tofinish the high-k dielectric layer 1, and to result in an annealingeffect such that a defect density of the N assigned films 12 is reduced,where N is a natural number and less than or equal to M. The arrangementrelationship between the atomic-layer-deposited films 11 withoutbombardment by a non-reactive gas plasma and the assigned films 12 withbombardment by the non-reactive gas plasma of the high-k dielectriclayer 1 according to the invention has been described in detail above,and will not be described in detail herein.

The material used to form the semiconductor layer and the inert gas usedto generate the non-reactive gas plasma have been described in detailabove, and will not be described herein.

In one embodiment, the oxide is HfO_(2.) The precursor of supplying Hfelement can be HfCl₄, HfI₄, HfCl₂[N(SiMe₃)₂]₂, HfCp₂Me₂, HfCp₂Cl₂,Hf(CpMe)₂Me₂, Hf(CpMe)₂(OMe)Me, Hf(CpMe)₂(OiPr)Me, Hf(CpMe)₂(mmp)Me,Hf(Cp)(NMe₂)₃, Hf(CpMe)(NMe₂)₃, Hf(Cp₂CMe₂)Me₂, Hf(Cp₂CMe₂)Me(OMe),Hf(OiPr)₄, Hf(OtBu)₄, Hf(OtBu)₂(mmp)₂, Hf(OtBu)(NEtMe)₃, Hf(mmp)₄,Hf(mp)₄, Hf(ONEt₂)₄, Hf(NMe₂)₄, Hf(NEt₂)₄, Hf(NEtMe)₄,Hf[N(SiMe₃)₂]₂Cl₂, Hf(NO₃)₄, etc. The precursor of supplying O elementcan be O₂ plasma, N₂O plasma, O₃, H₂O, H₂O₂, etc.

In another embodiment, the oxide is ZrO₂. The precursor of supplying Zrelement can be ZrCl₄, ZrI₄, ZrCp₂Cl₂, ZrCp₂Me₂, ZrCp₂Me(OMe),ZrCp(NMe₂)₃, Zr(CpMe)₂Me₂, Zr(CpMe)₂Me(OMe), Zr(CpMe)(NMe₂)₃,Zr(CpEt)(NMe₂)₃, Zr(Cp₂CMe₂)Me₂, Zr(Cp₂CMe₂)Me(OMe), Zr(OiPr)₄,Zr(OiPr)₂(dmae)₂, Zr(OtBu)₄, Zr(OtBu)₂(dmae)₂, Zr(dmae)₄, Zr(thd)₄,Zr(NMe₂)₄, Zr(NEt₂)₄, Zr(NEtMe)₄, Zr[N(SiMe₃)₂]₂Cl₂, Zr(MeAMD)₄, etc.The precursor of supplying O element can be O₂ plasma, N₂O plasma, O₃,H₂O, H₂O₂, etc.

In another embodiment, the oxide is Al₂O₃. The precursor of supplying Alelement can be AlCl₃, AlBr₃, AlMe₃, AlMe₂Cl, AlMe₂OiPr, AlEt₃, Al(OEt)₃,Al(OnPr)₃, Al(mmp)₃, Al(NEt₂)₃, Al(NiPr₂)₃, Al(iPrAMD)Et₂, etc. Theprecursor of supplying O element can be O₂ plasma, N₂O plasma, O₃, H₂O,H₂O₂, etc.

In another embodiment, the oxide is TiO₂. The precursor of supplying Tielement can be TiF₄, TiCl₄, TiI₄, Ti(CpMe₅)(OMe)₃, Ti(CpMe)(OiPr)₃,Ti(OMe)₄, Ti(OEt)₄, Ti(OiPr)₄, Ti(OiPr)₂(dmae)₂, Ti(OiPr)₂(thd)₂,Ti(trhd)₂(O(CMe₂Et)₂, Ti(OBu)₄, Ti(NMe₂)₄, TiCp₂((iPrN)₂C(NHiPr)), etc.The precursor of supplying O element can be O₂ plasma, N₂O plasma, O₃,H₂O, H₂O₂, etc.

In another embodiment, the oxide is La₂O₃. The precursor of supplying Laelement can be La(thd)₃, La[N(SiMe₃)₂]₃, La(iPrAMD)₃, La(iPrfAMD)₃,La(Cp)₃, La(CpEt)₃, La(CpiPr)₃, etc. The precursor of supplying Oelement can be O₂ plasma, N₂O plasma, O₃, H₂O, H₂O₂, etc.

In another embodiment, the oxide is SiO₂. The precursor of supplying Sielement can be SiCl₄, Si₂Cl₆, SiCl₃H, SiCl₂H₂, SiH₄, Si(OMe)₄, Si(OEt)₄,Si(OEt)₃((CH₂)₃NH₂), Si(OtPe)₃OH, HMDS, SiH₂(N(CH₃)₂)₂, SiH₂(NHtBu)₂,SiH₂(NEt₂)₂, SiH(N(CH₃)₂)₃, Si(NCO)₄, MeOSi(NCO)₃, etc. The precursor ofsupplying O element can be O₂ plasma, N₂O plasma, O₃, H₂O, H₂O₂, etc.

In another embodiment, the oxide is Y₂O₃. The precursor of supplying Yelement can be Y(thd)₃, YCp₃, Y(CpMe)₃, Y(CpEt)₃, Y(iPrAMD)₃, etc. Theprecursor of supplying O element can be O₂ plasma, N₂O plasma, O₃, H₂O,H₂O₂, etc.

In one embodiment, the non-reactive gas plasmas has a flow rate rangingfrom 1 sccm to 1000 sccm.

In one embodiment, the non-reactive gas plasmas has a working pressureranging from 100 torr to 10⁻³ torr.

Please refer to FIG. 4, FIG. 4 is a schematic diagram showing thearchitecture of a multi-function equipment 3 implementing the methodaccording to the invention.

As shown in FIG. 4, the multi-function equipment 3 according to theinvention includes a reaction chamber 30, a plasma source 31, a plasmasource power generating unit 32, a bias electrode 33, an AC voltagegenerating unit 34, a DC bias generating unit 35, a metal chuck 36, afirst precursor supply source 37, a second precursor supply source 38, acarrier gas supply source 44, an oxygen supply source 39, an inert gassupply source 40, an automatic pressure controller 41, and an vacuumpump 42.

The plasma source 31 is disposed in the reaction chamber 30 and at a top302 of the reaction chamber 30. The plasma source power generating unit32 is electrically connected to the plasma source 31, and is controlledto output an AC power to the plasma source 31. The bias electrode 33 isdisposed in the reaction chamber 30 and at a bottom 304 of the reactionchamber 30. The AC voltage generating unit 34 is electrically connectedto the bias electrode 33, and is controlled to selectively output an ACvoltage or the AC voltage combined with a DC bias to the bias electrode33 to control an energy of bombardment by a non-reactive gas plasma. Inone embodiment, the AC voltage generating unit 34 is controlled toselectively output an AC voltage or the AC voltage combined with a DCbias.

The DC bias generating unit 35 is electrically connected to the biaselectrode 33, and is controlled to selectively output a positive DC biasor a negative DC bias to the bias electrode 33 to control the energy ofbombardment by the non-reactive gas plasma. In one embodiment, the DCbias generating unit 35 is controlled to selectively output a positiveDC bias or a negative DC bias.

The metal chuck 36 is disposed on the bias electrode 33, and holds asemi-product of the semiconductor device 2.

The first precursor supply source 37 is connected with the reactionchamber 30 via a first control valve 372, and is controlled to supply afirst precursor of an oxide to the reaction chamber 30. The secondprecursor supply source 38 is connected with the reaction chamber 30 viaa second control valve 382, and is controlled to supply a secondprecursor of the oxide to the reaction chamber 30.

The carrier gas supply source 44 is connected with the reaction chamber30 via a first flow controller 442, and is controlled to supply acarrier gas to the reaction chamber 30.

The oxygen supply source 39 is connected with the top 302 of thereaction chamber 30 via a second flow controller 392, and is controlledto supply an oxygen gas, the oxygen gas being ionized by the AC power ofthe plasma source 31 into an oxygen plasma. The inert gas supply source40 is connected with the top 302 of the reaction chamber 30 via a thirdflow controller 402, and is controlled to supply an inert gas, the inertgas being ionized by the AC power of the plasma source 31 into anon-reactive gas plasma. The vacuum pump 42 is connected with the bottom304 of the reaction chamber 30 via the automatic pressure controller 41,and automatically controls a pumping rate via the automatic pressurecontroller 41 to achieve an ideal process pressure.

It is emphasized that the multi-function equipment 3 according to theinvention can perform non-reactive gas plasma bombardment in situ, thatis, the multi-function equipment 3 according to the invention canperform a non-reactive gas plasma bombardment in the reaction chamber 30without the need of moving the semi-product of the semiconductor device2 to another chamber. Further, during fabrication of the Matomic-layer-deposited films 10, the multi-function equipment 3according to the invention can perform a non-reactive gas plasmabombardment for N assigned films 12 among the M atomic-layer-depositedfilms 10 during or after cycles of the ALD process.

Also as shown in FIG. 4, the metal chuck 36 has an adjustable tilt anglerelative to the bias electrode 33 to alter the incident angle of thenon-reactive gas plasma bombardment of the assigned films 12, andfurther to control film quality and defect density of the assigned films12.

The invention proves that the high-k dielectric layer of the inventionhas a low leakage current density. The invention prepares a specimenlabeled as “DHe”. The specimen DHe consists of a plurality ofatomic-layer-deposited films of HfO₂ on a p-type silicon substratehaving a resistivity of 1-10 Ω-cm, and the lower half of theatomic-layer-deposited films is bombarded by He plasma. The inventionalso prepares a specimen labeled as “THe”. The specimen THe consists ofa plurality of atomic-layer-deposited films of HfO₂ on a p-type siliconsubstrate having a resistivity of 1-10 Ω-cm, and the upper half of theatomic-layer-deposited films is bombarded by He plasma. In contrast, theinvention also prepares a specimen labeled as “Hf0”. The specimen Hf0consists of a plurality of atomic-layer-deposited films of HfO₂ on ap-type silicon substrate having a resistivity of 1-10 Ω-cm, and all ofthe atomic-layer-deposited films are not bombarded by He plasma.Referring to FIG. 5, FIG. 5 is a schematic diagram of an ALD cycleprocess for fabricating the specimen DHe, the specimen THe, and thespecimen Hf0.

Next, the specimen DHe, the specimen THe and the specimen Hf0 arerespectively coated with Pt and Al on the atomic-layer-deposited filmsof HfO₂ and the backside of silicon substrate thereof as gate electrodesand lower electrodes to form metal-oxide-semiconductor structures.Thereafter, the specimen DHe, the specimen THe, and the specimen Hf0 aretreated with a post-metallization annealing (PMA) at 400° C. for 30minutes in an atmosphere of a forming gas of 5% H₂ and 95% N₂.

Please refer to FIG. 6 and FIG. 7. The XPS spectra of the PMA-treatedspecimen DHe, the PMA-treated specimen THe, and the PMA-treated specimenHf0 are shown in FIG. 6. HRTEM images of the PMA-treated specimen DHe,the PMA-treated specimen THe, and the PMA-treated specimen Hf0 are shownin FIG. 7. The results shown in FIG. 6 reveal that the PMA-treatedspecimen DHe has a higher peak intensity of silicate and so has athicker interfacial layer. The HRTEM images of FIG. 7 also demonstratethat the PMA-treated specimen DHe has a thicker interfacial layer. Thisis because the He plasma bombardment affects the region adjacent to thesilicon substrate during formation of the specimen DHe. In addition, asshown in FIG. 7, the total physical thicknesses of the dielectric layersin the specimen DHe, the specimen THe, and the specimen Hf0 are about 4nm.

Please refer to Table 1, the capacitance equivalent thicknesses (CET),effective dielectric constants (K_(eff)), gate leakage current densities(J_(g)) and interfacial state defect densities (D_(it)) of thePMA-treated specimen DHe, the PMA-treated specimen THe, and thePMA-treated specimen Hf0 are listed in Table 1. The gate leakage currentdensity (J_(g)) of the specimen is defined as the flat-band voltageapplied to the gate electrode subtracts 1 V. CETs of the PMA-treatedspecimen DHe, the PMA-treated specimen THe, and the PMA-treated specimenHf0 are less than 2 nm.

TABLE 1 with PMA treatment Hf0 DHe THe CET(nm) 1.61 1.85 1.61 K_(eff)9.69 8.43 9.7 J_(g)(A/cm²) 1.67 × 10⁻⁴ 1.34 × 10⁻⁵ 2.44 × 10⁻⁵D_(it)(cm⁻²eV⁻¹) 7.25 × 10¹¹  3.46 × 10¹¹  4.60 × 10¹¹ 

The results listed in Table 1 confirm that both the leakage currentdensities of the PMA-treated specimen DHe and the PMA-treated specimenTHe are lower than 1×10⁻⁴ A/cm², which are better than that of thePMA-treated specimen Hf0 not bombarded by He plasma. It is evident thatthe He plasma bombardment can effectively improve the film quality ofthe high-k dielectric layer of the invention and reduce the defectdensity of the high-k dielectric layer of the invention.

Please refer to FIG. 8. The results of a constant voltage stress test ofthe PMA-treated specimen DHe, the PMA-treated specimen THe, and thePMA-treated specimen Hf0 are shown in FIG. 8, where the voltage appliedto the gate electrode of the specimens is −4 V, and the times of appliedvoltage are 0, 40, 100, 400, and 1000 sec, respectively. The resultsshown in FIG. 8 confirm that, compared with the PMA-treated specimenHf0, when the PMA-treated specimen DHe and the PMA-treated specimen THeare applied at low gate voltages (the absolute values of the gatevoltages are less than 2 V), the rising degree of gate leakage currentdensities of the PMA-treated specimen DHe and the PMA-treated specimenTHe is low. It is evident that the specimen DHe and the specimen THe,which are bombarded by He plasma, have better reliability.

With the example and explanations above, the features and spirits of theinvention will be hopefully well described. Those skilled in the artwill readily observe that numerous modifications and alterations of thedevice may be made while retaining the teaching of the invention.Accordingly, the above disclosure should be construed as limited only bythe metes and bounds of the appended claims.

What is claimed is:
 1. A multi-function equipment for fabricating a thinfilm, said multi-function equipment comprising: a reaction chamber; aplasma source, disposed in the reaction chamber and at a top of thereaction chamber; a plasma source power generating unit, beingelectrically connected to the plasma source, and being controlled tooutput an AC power to the plasma source; a bias electrode, disposed inthe reaction chamber and at a bottom of the reaction chamber; an ACvoltage generating unit, being electrically connected to the biaselectrode, and being controlled to selectively output an AC voltage orthe AC voltage combined with a DC bias to the bias electrode to controlan energy of bombardment by a non-reactive gas plasma; a DC biasgenerating unit, being electrically connected to the bias electrode, andbeing controlled to selectively output a positive DC bias or a negativeDC bias to the bias electrode to control the energy of bombardment bythe non-reactive gas plasma; a metal chuck, disposed on the biaselectrode, for holding a semi-product of the device; a first precursorsupply source, connected with the reaction chamber via a first controlvalve, and being controlled to supply a first precursor of a thin filmto the reaction chamber; a second precursor supply source, connectedwith the reaction chamber via a second control valve, and beingcontrolled to supply a second precursor of the thin film to the reactionchamber; a carrier gas supply source, connected with the reactionchamber via a first flow controller, and being controlled to supply acarrier gas to the reaction chamber; an oxygen supply source, connectedwith the top of the reaction chamber via a second flow controller, andbeing controlled to supply an oxygen-containing gas, theoxygen-containing gas being ionized by the AC power of the plasma sourceinto an oxygen plasma; a nitrogen supply source, connected with the topof the reaction chamber via a second flow controller, and beingcontrolled to supply a nitrogen-containing gas, the nitrogen-containinggas being ionized by the AC power of the plasma source into a nitrogenplasma; an inert gas supply source, connected with the top of thereaction chamber via a third flow controller, and being controlled tosupply an inert gas, the inert gas being ionized by the AC power of theplasma source into a non-reactive gas plasma; an automatic pressurecontroller; and a vacuum pump, connected with the bottom of the reactionchamber via the automatic pressure controller, and automaticallycontrolling a pumping rate via the automatic pressure controller toachieve an ideal process pressure; wherein said multi-function equipmentis used to fabricate the thin film by performing the steps of:performing an ALD process to form M atomic-layer-deposited films of thethin film in sequence on the semi-product of the device, wherein M is aninteger larger than 1; and for N assigned films among the Matomic-layer-deposited films, bombarding the N assigned films by thenon-reactive gas plasma during or after cycles of the ALD process tofinish the said thin film, and to result in an annealing effect suchthat a defect density of the N assigned films is reduced, wherein N is anatural number and less than or equal to M.
 2. The multi-functionequipment of claim 1, wherein the metal chuck has an adjustable tiltangle relative to the bias electrode.